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Plasma Etch MK II Industrial Plasma Etching System, 2017

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Machine Type:
Process Equipment
Make:
Plasma Etch
Model:
MK II
Year:
2017
 
SPECIFICATIONS
 
Process Temperature Control: 125F - 300F + - 5F
Electrostatic Shielding
6 Level Horizontal Planar Electrode Configuration
24"W x 18"D, 1.50" Spacing
Color Touch Screen PC Control System
Intuitive Custom Plasma Etch, INC. Software
1200W 13.56 MHz Solid State RF Generator
Automatic RF Matching Network
30CFM Oxygen Service Vacuum Booster
2-2000 SCCM Mass Flow Controllers, 2 Gas Channels
Automatic Nitrogen Purging for Vacuum Pump
Oil Mist Coalescing Filter on Vacuum Pump Exhaust

All specifications are assumed to be correct but must be confirmed by the purchasing entity.


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