Isel Wafer Handling Robot, Logosol Pre Aligner – 2023

Repeatability
T ±0.02°
R ±0.02 mm
Z ±0.02 mm
Working Range: Z 10″
Radial: 10″
Theta: 500°
Payload: up to 3 kg
Maximum Speed:
T 360°/s
R 1,000 mm/s
Z 450 mm/s
Power supply: 115 – 230 VAC
50 – 60 Hz
500 VA (standard)
550 VA (advanced)
Main Interface: RS-232 [DB9]
Ethernet [RJ-45]
Weight approx. 25 – 32 kg

Equipped With:
– 2x 4mm hoses compressed air (EEF1, 5 bar)
– 1x 3,2mm tube vacuum (EEF2)
– I/O ́s : +24V, GND, flu signal IN3, flu detection IN4, mapper OUT5,
Mapper IN5, Gripper OUT9

3 axis Prealigner, 3-8″
Vacuum, Peek chuck, 10KCPR
Bottom entry
LPA-38-3-V40P1-S23-B-V500P-NE
Standalone

Specs:
Wafer Diameter 3″, 100mm, 125mm, 150mm, 200mm
Wafer Opacity Transparent, Semi-Transparent, Opaque
Square Substrates Applicable
Wafer Handling Vacuum Chuck and Pins
Centering Accuracy ±25um on the Prealigner Chuck
Angular
Accuracy
(3 Sigma)
10000 CPR Encoder ±0.04° on the Prealigner Chuck
24000 CPR Encoder ±0.02° on the Prealigner Chuck
Servo Axes Three
Host Communication RS232, Ethernet
Max Initial Wafer Offset 12mm
Body Dimensions (W x L x H) 173mm x 267mm x 190mm
Footprint Compatibility LPA26-3, LPA58-3
LPA4EH-3, LPA5EH-3, LPA6EH-3, LPA8EH-3
Weight 5.00kg
Facilities Required 100-240VAC, 50/60Hz, 48VA, or 24VDC/2A
Vacuum 12″ Hg
Flat/Notch Compatibility SEMI Standards Compliant
Cleanliness Class 1
MTBF More than 70000 hours

*Standard wait time on new unit-50 weeks

This unit is unused and available immediately