Hesse BJ985 Wire Bonder – 2021 – Heavy Wire Wedge Bonder for Power Electronics & Semiconductors

Wire Materials: Aluminum (Al), Copper (Cu), Aluminum-Copper (AlCu)

Wire Diameter Range: 50 μm – 600 μm (2 mil – 24 mil)

Ribbon Dimensions: 250 μm x 25 μm up to 2000 μm x 400 μm (10 mil x 1 mil up to 80 mil x 16 mil); Copper ribbons up to 200 μm thickness

Bondhead Frequency: 60 kHz (alternative frequencies available upon request)

Cutting Methods: Active, Passive, Air Cut (for frontcut)

Working Area
X-Axis: 370 mm

Y-Axis: 870 mm

Z-Axis: 42 mm

P-Rotation: 440°

230V AC, 50-60 Hz, 1 Phase
Current: 4.5A

Footprint (W x D x H): 880 mm x 1780 mm x 1912 mm (excluding monitor and light tower)

Weight: 1800 kg